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  pc852xj0000f series PC853XJ0000F series 1. recognized by ul1577, file no. e64380 (as model no. pc852/pc853 ) 2. approved by vde, din en60747-5-2 ( ) (only for pc852xj0000f series as an option), file no. 40008087 (as model no. pc852 ) 3. package resin : ul flammability grade (94v-0) ( ) din en60747-5-2 : successor standard of din vde0884 features agency approvals/compliance 1. telephone line interface/isolation 2. interface to power supply circuit 3. controller for ssrs, dc motors applications dip 4pin darlington phototransistor ouput, high collector-emitter voltage photocoupler 1. 4pin dip package 2. double transfer mold package (ideal for flow solder- ing) 3. high collector-emitter voltage (v ceo : 350v) 4. durlington phototransistor output (ctr : min. 1 000% at i f =1ma, v ce =2v) 5. large collector power disspation : PC853XJ0000F (p c : 300mw) 6. high isolation voltage between input and output (v iso(rms) : 5kv) 7. lead-free and rohs directive compliant description pc852xj0000f series/PC853XJ0000F series con- tains an ired optically coupled to a phototransistor. it is packaged in a 4-pin dip, available in smt gullw- ing lead-form option. input-output isolation voltage(rms) is 5.0kv. collector-emitter voltage is 350v and ctr is min. 1 000% at input current of 1ma. 1 notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc852xj0000f series/PC853XJ0000F series sheet no.: d2-a04002en date jun. 30. 2005 ? sharp corporation
internal connection diagram anode cathode emitter collector 1 1 3 4 5 2 4 3 2 outline dimensions pc852xj0000f series (unit : mm) 1. through-hole [ex. pc852xj0000f ] 4. smt gullwing lead-form (vde option) [ex. pc852xpyj00f ] product mass : approx. 0.22g product mass : approx. 0.22g plating material : sncu (cu : typ. 2%) product mass : approx. 0.23g product mass : approx. 0.23g pc852 factory identification mark date code 4.58 0.5 0.6 0.2 1.2 0.3 2.54 0.25 6.5 0.5 anode mark 7.62 0.3 4.58 0.5 3.5 0.5 3.0 0.5 2.7 0.5 0.5 typ. 0.5 0.1 : 0 to 13? epoxy resin 0.26 0.1 1 2 4 3 0.6 0.2 1.2 0.3 6.5 0.5 7.62 0.3 0.26 0.1 4.58 0.5 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.3 2.54 0.25 4 3 anode mark factory identification mark date code 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.35 0.25 1 2 4 pc852 vde identification mark sharp mark "s" pc852xj0000f series/PC853XJ0000F series 2. through-hole (vde option) [ex. pc852xyj000f ] pc852 4 factory identification mark date code vde identification mark 4.58 0.5 0.6 0.2 1.2 0.3 2.54 0.25 6.5 0.5 anode mark 7.62 0.3 4.58 0.5 3.5 0.5 3.0 0.5 2.7 0.5 0.5 typ. 0.5 0.1 : 0 to 13? epoxy resin 0.26 0.1 1 2 4 3 sharp mark "s" 3. smt gullwing lead-form [ex. pc852xij000f ] 0.6 0.2 1.2 0.3 6.5 0.5 7.62 0.3 0.26 0.1 4.58 0.5 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.3 2.54 0.25 4 3 anode mark factory identification mark date code 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.35 0.25 1 2 pc852 sheet no.: d2-a04002en
3 (unit : mm) pc852xj0000f series/PC853XJ0000F series 1. through-hole [ex. PC853XJ0000F ] pc853 factory identification mark date code 4.58 0.5 0.6 0.2 1.2 0.3 2.54 0.25 6.5 0.5 anode mark 7.62 0.3 4.58 0.5 3.5 0.5 3.0 0.5 2.7 0.5 0.5 typ. 0.5 0.1 : 0 to 13? epoxy resin 0.26 0.1 1 2 4 3 2. smt gullwing lead-form [ex. pc853xij000f ] product mass : approx. 0.22g product mass : approx. 0.23g 0.6 0.2 1.2 0.3 6.5 0.5 7.62 0.3 0.26 0.1 4.58 0.5 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.3 2.54 0.25 4 3 anode mark factory identification mark date code 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.35 0.25 1 2 pc853 PC853XJ0000F series sheet no.: d2-a04002en
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark factory identification mark no mark country of origin japan indonesia china * this factory marking is for identification purpose only. please contact the local sharp sales representative to see the actural status of the production. 4 repeats in a 20 year cycle pc852xj0000f series/PC853XJ0000F series sheet no.: d2-a04002en rank mark there is no rank mark indicator.
electro-optical characteristics parameter conditions forward voltage reverse voltage terminal capacitance collector dark current transfer charac- teristics collector current collector-emitter saturation voltage collector-emitter breakdown voltage isolation resistance cut-off frequency min. ? ? ? ? 10 ? 5 10 10 1 ? typ. 1.2 ? 30 ? ? 40 ? 1 10 11 7 20 max. 1.4 10 250 200 150 ? 1.2 ? ? 100 unit v v a pf na ma v ? s s symbol v f i r c t i ceo bv ceo i c v ce (sat) r iso t f f c response time rise time fall time input output i f = 10ma v r = 4v v = 0, f = 1khz v ce = 200v, i f = 0 i c = 0.1ma, i f = 0 i f = 1ma, v ce = 2v dc500v, 40 to 60%rh v ce = 2v, i c = 20ma, r l = 100 ? ? 100 300 khz t r v ce = 2v, i c = 20ma, r l = 100 ? , ? 3db floating capacitance ? 0.6 1.0 c f pf v = 0, f = 1mhz i f = 20ma, i c = 100ma 350 (t a = 25?c) absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current a power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1 minute, f=60hz *3 for 10s rating pc852xj0000f PC853XJ0000F 50 1 70 reverse voltage v v r 6 350 0.1 150 150 200 300 320 ? 30 to + 100 ? 55 to + 125 260 5.0 kv 5 pc852xj0000f series/PC853XJ0000F series sheet no.: d2-a04002en
model line-up lead form package din en60747-5-2 model no. sleeve 100pcs/sleeve through-hole - pc852xj0000f approved pc852xyj000f - pc852xij000f taping 2 000pcs/reel smt gullwing - pc852xpj000f approved pc852xpyj00f model no. lead form package din en60747-5-2 PC853XJ0000F through-hole - pc853xij000f 100pcs/sleeve sleeve - pc853xpj000f smt gullwing taping 2 000pcs/reel - 6 please contact a local sharp sales representative to inquire about production status. pc852xj0000f series/PC853XJ0000F series pc852xj0000f series PC853XJ0000F series sheet no.: d2-a04002en
fig.4 total power dissipation vs. ambient temperature 0 ? 30 10 025507 5 100 125 20 30 40 50 60 ambient temperature t a (?c) forward current i f (ma) fig.1 forward current vs. ambient temperature 7 pc852xj0000f series/PC853XJ0000F series 100 200 300 320 400 500 0 ambient temperature t a (?c) total power dissipation p tot (mw) 0255 075 100 125 ? 30 PC853XJ0000F pc852xj0000f fig.5 peak forward current vs. duty ratio duty ratio pulse width 100 s t a = 25?c 10 100 10 ? 3 10 ? 2 10 ? 1 peak forward current i fm (ma) 1 10 000 1 000 fig.3-b collector power dissipation vs. ambient temperature 0 100 350 50 150 250 200 300 collector power dissipation p c (mw) ambient temperature t a (?c) ? 30 0 25 50 75 100 125 (PC853XJ0000F) 0 0 125 100 200 50 150 25 50 75 100 ? 30 collector power dissipation p c (mw) ambient temperature t a (?c) (pc852xj0000f) fig.3-a collector power dissipation vs. ambient temperature diode power dissipation p (mw) ambient temperature t a (?c) 0 100 80 70 60 40 20 ? 30 0 25 50 55 75 100 125 fig.2 diode power dissipation vs. ambient temperature sheet no.: d2-a04002en
50 0 100 150 020406 080 100 relative current transfer ratio (%) ambient temperature t a (?c) i f = 1ma v ce = 2v ? 30 fig.9 relative current transfer ratio vs. ambient temperature 8 fig.7-b current transfer ratio vs. forward current 0 0 100 200 12345 0.5ma 1ma 1.5ma 2ma 2.5ma 3ma 5ma collector current i c (ma) collector-emitter voltage v ce (v) p c (max.) t a = 25?c i f = 10ma (pc852xj0000f) fig.8-a collector current vs. collector- emitter voltage 0 0.1 current transfer ratio ctr (%) 10 1 forward current i f (ma) v ce = 2v t a = 25?c 5 000 4 000 3 000 2 000 1 000 (PC853XJ0000F) fig.8-b collector current vs. collector- emitter voltage 0.5ma 1ma 1.5ma 2ma 2.5ma 3ma 5ma p c (max.) i f = 10ma 0 0 100 200 12345 collector current i c (ma) collector-emitter voltage v ce (v) t a = 25?c (PC853XJ0000F) pc852xj0000f series/PC853XJ0000F series 0 0.1 current transfer ratio ctr (%) 10 1 forward current i f (ma) v ce = 2v t a = 25?c 5 000 4 000 3 000 2 000 1 000 (pc852xj0000f) fig.7-a current transfer ratio vs. forward current fig.6 forward current vs. forward voltage 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 10 100 1 forward voltage v f (v) forward current i f (ma) 50?c 25?c 0?c ? 25?c t a = 75?c sheet no.: d2-a04002en
frequency f (khz) 0 0.1 110 100 100 ? 10 ? voltage gain a v (db) v ce = 2v i c = 20ma t a = 25?c r l = 1k ? 1 000 ? 25 ? 20 ? 15 ? 10 ? 5 fig.14 frequency response remarks : please be aware that all data in the graph are just for reference and not for guarantee. 9 collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 0 1 2 3 4 5 12345 10ma 30ma 50ma 70ma 100ma t a = 25?c i c = 5ma fig.15 collector-emitter saturation voltage vs. forward current response time ( s) 1 10 100 0.01 0.1 1 10 v ce = 2v i c = 20ma t a = 25?c t r t f t d t s 1 000 load resistance r l (k ? ) fig.12 response time vs. load resistance v cc t f t r t s 90% 10% t d output input r l input output r d please refer to the conditions in fig.12. v ce fig.13 test circuit for response time pc852xj0000f series/PC853XJ0000F series 20 0 40 60 80 100 10 ? 10 10 ? 9 10 ? 8 10 ? 7 10 ? 6 10 ? 5 collector dark current i ceo (a) ambient temperature t a (?c) v ce = 200v ? 30 10 ? 11 fig.11 collector dark current vs. ambient temperature 0 ? 30 0.2 0204 06080100 0.4 0.6 0.8 1 1.2 ambient temperature t a (?c) collector-emitter saturation voltage v ce (sat) (v) i f = 20ma i c = 100ma fig.10 collector - emitter saturation voltage vs. ambient temperature sheet no.: d2-a04002en
design considerations while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 10 2.2 2.54 1.7 8.2 (unit : mm) design guide pc852xj0000f series/PC853XJ0000F series sheet no.: d2-a04002en
manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 11 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc852xj0000f series/PC853XJ0000F series sheet no.: d2-a04002en
solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated di- phenyl ethers (pbde). presence of odc 12 pc852xj0000f series/PC853XJ0000F series sheet no.: d2-a04002en
sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions package specification 13 (unit : mm) 12.0 6.7 5.8 10.8 520 2 pc852xj0000f series/PC853XJ0000F series sheet no.: d2-a04002en
14 tape and reel package package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h h a c 5? max. dimensions list (unit : mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.4 0.05 j 4.2 0.1 k 5.1 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 2 000pcs/reel] reel structure and dimensions direction of product insertion pc852xj0000f series/PC853XJ0000F series sheet no.: d2-a04002en
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. 15 important notices pc852xj0000f series/PC853XJ0000F series sheet no.: d2-a04002en [e203]


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